Samsung Tackles Chip Challenges with AI Investments and Foldable Tech

Samsung Electronics faces semiconductor challenges like supply chain issues and competition from TSMC, but invests heavily in AI R&D and advanced packaging. Amid Q1 profits and foundry losses, it eyes M&A, Tesla deals, and foldable innovations like the tri-fold Galaxy G-Fold. Geopolitical tensions add complexity, yet AI recovery offers hope.
Samsung Tackles Chip Challenges with AI Investments and Foldable Tech
Written by David Ord

In the rapidly evolving world of semiconductors, Samsung Electronics Co. is navigating a complex web of challenges and opportunities as it heads into the latter half of 2025. The South Korean tech giant, a key player in memory chips and foundry services, has been grappling with supply chain disruptions and intense competition from rivals like TSMC and Intel. According to a recent report from Samsung Securities, the company faces difficulties in upward earnings revisions for general-purpose semiconductors due to ongoing production controls aimed at accelerating cycle recovery. This caution stems from uncertain capital expenditure (Capex) and utilization rate forecasts, which investors are watching closely for signs of a bottom-out.

Samsung’s strategic investments, however, signal a bold push forward. The company recently held a tool-in ceremony for its new semiconductor R&D complex, NRD-K, set to begin operations this year, with plans to pour about 20 trillion won ($14.8 billion) into advanced R&D by 2030, as detailed in the Samsung Global Newsroom. This move is part of a broader effort to bolster AI-driven semiconductors, where Samsung sees higher earnings visibility amid the global AI boom.

Investors Eye AI as Samsung’s Lifeline Amid Market Pressures

First-quarter 2025 results underscored both strengths and vulnerabilities, with Samsung reporting revenue of 79.14 trillion won and operating profit of 6.7 trillion won, per the company’s own announcements in the Samsung Global Newsroom. Yet, shareholders have pressed for growth strategies, leading CEO Kyung Kye-hyun to hint at pursuing major mergers and acquisitions this year to counter underperformance in tech stocks, as covered by Reuters. The failure to fully capitalize on AI has been a sore point, with Samsung’s foundry business posting losses of $3.6 billion in the first half of the year, though a $16.5 billion deal with Tesla for AI chips starting in 2027 offers a glimmer of hope, according to posts circulating on X from industry analysts.

Beyond semiconductors, Samsung is innovating in consumer devices to diversify revenue. The foldable smartphone segment is heating up, with the company planning to strengthen its lineup, including the rumored Galaxy G-Fold tri-fold phone slated for a late-2025 launch, as revealed in leaks reported by Geeky Gadgets. This comes amid growing competition from Huawei and Google, with market overviews from Coherent Market Insights forecasting robust industry growth through 2032.

Strategic Shifts in Foundry and Packaging Technologies

Samsung’s ambitions extend to advanced packaging, where it’s exploring Intel’s hybrid bonding technology to enhance chip density and efficiency, as noted in recent X posts from tech enthusiasts like Techo Vedas. This could position Samsung better against TSMC, whose 2nm process is eyeing mass production in Q4 2025 with a monthly capacity of 100,000 wafers by 2026, according to semiconductor news aggregated on X by inni world. Meanwhile, Samsung’s own 2nm advancements are crucial for reclaiming market share, especially as global wafer foundry revenue surged 14.6% to $41.7 billion in Q2, with TSMC dominating over 70% of the market.

The company’s mobile division is also adapting, with expectations for a delayed flagship processor launch and expanded Galaxy AI features across premium devices, as outlined in X updates from insider Anthony. Price increases for components and a focus on thinner, redesigned foldables aim to counter Apple’s rumored 2026 entry into the foldable arena, per Business Insider.

Geopolitical Tensions and Supply Chain Resilience

Geopolitical factors add another layer of complexity. China’s record chip exports of $89.85 billion in the first seven months of 2024, despite U.S. sanctions, highlight shifting dynamics that could pressure Samsung, as discussed in X posts by Barrett. Samsung’s response includes bolstering domestic capabilities, such as the joint task force for a Galaxy-only chip by 2025, echoing earlier strategies reported in X threads from Anthony dating back to 2022.

Looking ahead, Samsung’s semiconductor outlook hinges on AI recovery evidence, with traditional equipment investments poised to rebound once cycle improvements materialize, per the Sourceability analysis. The resolution of excess inventory is paving the way for growth, but challenges like Intel’s Arrow Lake setbacks and Huawei’s R&D surges, as per X semiconductor news from inni world, underscore the need for agility.

Innovation Beyond Chips: Foldables and Emerging Tech

In foldables, Samsung’s Galaxy Z Fold 7 and Flip models are stacking up well against competitors like Motorola and Google, with expert reviews from ZDNet praising next-gen features. The tri-fold Galaxy G-Fold, detailed in Gadget Hacks, promises to redefine multitasking with its expansive

Subscribe for Updates

HiTechEdge Newsletter

Tech news and insights for technology and hi-tech leaders.

By signing up for our newsletter you agree to receive content related to ientry.com / webpronews.com and our affiliate partners. For additional information refer to our terms of service.

Notice an error?

Help us improve our content by reporting any issues you find.

Get the WebProNews newsletter delivered to your inbox

Get the free daily newsletter read by decision makers

Subscribe
Advertise with Us

Ready to get started?

Get our media kit

Advertise with Us