Intel updates mobile technology work

    April 10, 2003

TOKYO — Intel announced few surprises at its Intel Developer Forum Japan event on Thursday, instead choosing to give the Japanese audience a look at several technologies first disclosed at a U.S. event in February.

Despite the lack of surprises, the company did announce several updates on its technology work, mainly in the mobile sector. In the flash memory sector, an area where Intel is very strong, the company announced development of an improved memory packaging technique that allows it to stack as many as five flash memory chips in a single package 1.2mm thick.

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